Low-Temperature Co-Fired Ceramic (LTCC)

Low-Temperature Co-Fired Ceramic (LTCC) packaging technology is ideal for high-frequency electronics applications and high-reliability designs required in harsh operating environments.

LTCC packaging technology offers many advantages such as:

  • Multi-layered structure for reduced package size.
  • Buried passive components that offer up to 50% size reduction compared to PCBs.
  • Three-dimensional proprietary circuit design that protects intellectual property.
  • The ability to withstand extreme operating temperatures from -170 C to +350 C.
  • Stability and low-loss in high-frequency applications up to 60 GHz.

Common LTCC applications include:

  • Conventional energy, health and medical, cleantech, agriculture and forestry.
  • High-temperature electronics.
  • High-frequency wireless applications.
  • Optoelectronics.

ACAMP offers complete design, assembly, testing and manufacturing services for LTCC packaging.

To learn more, please contact us at, +1-780-468-2443 or +1-403-291-8946.


Microfluidic systems allow for the precise control and manipulation of fluids at volumes thousands of times smaller than a droplet, and are used in a wide variety of biomedical and environmental testing.

Microfluidic systems can be used for:

  • Lab-on-a-Chip devices.
  • Molecular testing.
  • Micro-mixers.
  • Capillary electrophoresis.
  • DNA amplification (Polymerase Chain Reaction and similar).
  • Optical assemblies.
  • MEMS (Micro-Electro-Mechanical systems).

ACAMP designs, develops and manufactures microfluidic structures.

To learn more, please contact us at, +1-780-468-2443 or +1-403-291-8946.

Embedded systems

An embedded system is a computer system with a dedicated function, placed within a larger mechanical or electrical system as part of a complete device. They are found in consumer, industrial sensing, automotive, rapid pathogen detection, biomedical diagnostic instrumentation, fibre optic communication, commercial, and military applications.

Embedded systems have significant advantages:

  • Smaller size.
  • Low power consumption.
  • Rugged operating ranges.
  • Low per-unit cost.
  • Less onerous requirements for their operating system.
  • Rarely need major hardware changes.

Embedded systems can be found in:

  • Autonomous vehicle systems.
  • Consumer and household electronics.
  • GPS receivers.
  • Dedicated routers and network bridges in computers.
  • Transportation control systems.
  • Industrial controllers.
  • Hybrid vehicles.
  • Medical diagnostic equipment.
  • Avionics.

ACAMP integrates embedded systems comprised of firmware, control systems and associated sensors to support hardware product development.

We provide cost-effective access to engineering expertise and world-class advanced analytical, testing and manufacturing equipment.

To learn more, please contact us at, +1-780-468-2443 or +1-403-291-8946.

Optics and photonics

Optoelectronics and photonics products incorporate electronic devices that source, detect and control light.

Many new applications include optics along with electronics to produce electrical-to-optical or optical-to-electrical transducers for instrumentation.

Optoelectronics enable cost-effective advances in a wide range of applications such as:

  • Ultra-high speed digital communication.
  • Remote sensing.
  • Gas detection.
  • Industrial sensing.
  • Biomedical instrumentation for diagnostics and pathogen detection.

ACAMP offers complete optical design and simulation services, and manufacturing, and testing infrastructure for prototyping and low-volume manufacturing.

To learn more, please contact us at, +1-780-468-2443 or +1-403-291-8946.

RF board & antenna design

Industrial Internet of Things applications and autonomous systems rely on wireless electronics that incorporate RF boards and antenna technologies. There is an increasing trend to utilize higher gigahertz frequencies ranges, especially for autonomous vehicles.

ACAMP can design and develop your RF board and antenna, optimize performance through simulation using advanced software tools, test and characterize reciprocity (gain, radiation pattern, impedance, bandwidth, resonant frequency and polarization), noise and interference, and build a prototype.

To learn more about how we can help with your RF and antenna product development, please contact us at, +1-780-468-2443 or +1-403-291-8946.

Electronic packaging & assembly

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The case, known as a ‘package’, supports the electrical contacts which connect the device to a circuit board.

In the integrated circuit industry, it is called simply ‘packaging’ and sometimes ‘semiconductor device assembly’, ‘assembly’, ‘encapsulation’ or ‘seal’.

ACAMP can design and develop a System in Package (SiP), which integrates electronic components like semiconductor dies, passive components, and other elements including MEMS and optical devices, into a single high-density custom package or module that provides multiple functions found in an electronic system or sub-system.

To learn more, please contact us at, +1-780-468-2443 or +1-403-291-8946.

Tools and equipment

ACAMP is especially different from other product development centres: we are the only organization in Canada that offers clients access to more than 400 pieces of state-of-the-art specialized development equipment.

Some of our unique testing and characterization capabilities include:

  • Physical reliability testing i.e. temperature, humidity, vibration, drop shock, altitude.
  • High-resolution inspection for failure analysis.
  • Material composition and contamination detection.
  • Inertial sensor testing and calibration.
  • Leak testing to check hermetic seal integrity.
  • Optical and electrical testing and measurement.
  • Class 10,000 Clean Rooms.

ACAMP has high-accuracy assembly and machining equipment to manufacture electronics.

Our capabilities include:

  • Die placement and bonding.
  • Wire bonding in a variety of metals.
  • Precision liquid dispense robots for epoxy and solder paste.
  • Optical fiber alignment and attachment equipment.
  • E-beam welding of exotic metal.
  • Package sealing under controlled or vacuum conditions.
  • Lithography and electroforming.

Contact us to discuss how your innovation needs can benefit uniquely from our state-of-the-art product development equipment. Email us: or call us: +1-780-468-2443 or +1-403-291-8946.