Electronic packaging & assembly
Posted on October 12, 2017
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The case, known as a ‘package’, supports the electrical contacts which connect the device to a circuit board.
In the integrated circuit industry, it is called simply ‘packaging’ and sometimes ‘semiconductor device assembly’, ‘assembly’, ‘encapsulation’ or ‘seal’.
ACAMP can design and develop a System in Package (SiP), which integrates electronic components like semiconductor dies, passive components, and other elements including MEMS and optical devices, into a single high-density custom package or module that provides multiple functions found in an electronic system or sub-system.
To learn more, please contact us at info@acamp.ca, +1-780-468-2443 or +1-403-291-8946.