Services

Client Requirements

Viable ACAMP clients must demonstrate their technology is at the stage of potential growth that requires targeted business development, product development expertise, or packaging and assembly support.

Clients must provide:

A prototype
A business case
- An overview of the IP
- Identify the target market
- Identify the industry problem issue that the technology will resolve
- Identify the competition
- The potential for a return on investment

ACAMP’s services encompass three key areas identified as critical for the commercialization of MNT products - Marketing & Business Development, Product Development, Packaging and Assembly.

Capabilities

Prototyping and low volume MNT manufacturing

Fully flexible manufacturing capability from initial prototyping to low volume manufacturing
Development of custom process flows

Simulation and prototype design for MNT based hardware products

Ansys multiphysics
ADS high speed system simulation
Zemax and OptiBPM optical simulations
Solidworks 3-D modelling

Microfluidics 12 inch hot embossing manufacturing

Polymer chips (PMMA, COC and others)
On chip electrodes, valves, pumps, heaters and other components
Design and development of florescent readers
In house nickel mold making capability for rapid turnaround prototyping

Low temperature cofired ceramic (LTCC) manufacturing

up to 25 layer ceramic circuit boards with integrated resistors, capacitors and inductors
Hermetic cavity sealing
Pins, solder balls and other connectors
Application expertise in:
- High temperature electronics and sensors
- RF and microwave
- High reliability assembly for sensing and other applications
- Inertial and GNSS sensors

MEMS & NEMS sensor packaging, assembly and test

Vacuum packaging for resonant sensors
Ceramic and plastic cavity packages

Optical packaging, assembly and test

Free space micro-optics including mid-IR lasers
Fiber coupled packages for components and subsystems
RF feed-throughs

Ultrasound transducer & sensor test and characterization

Encapsulation and packaging of ultrasound transducers
Design of ultrasound systems

Lithography and electroforming

5um patterning capability for thick and thin resists
Electroforming and electroplating of Ni, Cu, Al

Micromachining

High precision laser cutter
Electron beam welding

Characterization and failure analysis

Comprehensive suite of tools for characterization and failure analysis
- SEM with EDS, X-ray, scanning acoustic microscope, surface profilometer, tensile/compression test
- Reliability testing - temperature, humidity, thermal shock, drop shock, vibration
- Optical test tools
- Suite of simulation tools

Inertial product assembly, test, characterization and measurement

High precision 3-axis rate table for IMU characterization
Electrical measurement capability DC-60 GHz
In-line measurement for process control